Shielding via display chassis

ABSTRACT

An electronic device includes a case, an antenna supported by the case, a display module disposed within the case, a conductive chassis disposed within the case, the conductive chassis structurally supporting the display module, an electronics module disposed within the case such that the conductive chassis is positioned between the antenna and the electronics module, and an interconnect that electrically connects the conductive chassis and the case, the interconnect extending around the electronics module.

DESCRIPTION OF THE DRAWING FIGURES

For a more complete understanding of the disclosure, reference is madeto the following detailed description and accompanying drawing figures,in which like reference numerals may be used to identify like elementsin the figures.

FIG. 1 is a plan view of an electronic device having a display chassisconfigured for shielding in accordance with one example.

FIG. 2 is a cross-sectional view of the electronic device of FIG. 1taken along lines II-II of FIG. 1 to depict the display chassis and aninterconnect of the electronic device in greater detail.

FIG. 3 is a cross-sectional view of the display chassis and theinterconnect of the electronic device of FIG. 1 taken along linesIII-III of FIG. 2 to depict the interconnect in greater detail.

FIG. 4 is a side view of an interconnect contact in accordance with oneexample.

FIGS. 5 and 6 are side views of an interconnect contact in accordancewith another example.

FIGS. 7 and 8 are side views of an interconnect contact in accordancewith yet another example.

FIG. 9 is a block diagram of an electronic device for which a displaychassis may be used to support a display module and provide shieldingfor an antenna.

The disclosed devices may assume various forms. Specific examples areillustrated in the drawing (and are hereafter described) with theunderstanding that the disclosure is intended to be illustrative, and isnot intended to limit the invention to the specific examples describedand illustrated herein.

DETAILED DESCRIPTION

Electronic devices include an electronics module disposed within a caseor shell. One or more antennas supported by the case are shielded fromelectromagnetic noise generated by the electronics module. The shieldingis provided by a chassis disposed within the case to structurallysupport a display module of the electronic device. The chassis formspart of a shield lid that covers the electronics module. Leveraging thechassis for the additional purpose of shielding may render circuit- orboard-level shielding unnecessary. The electronic device may be thinnerand/or lighter without such components dedicated solely to noiseshielding.

The shield lid includes an interconnect that electrically connects thechassis to the case, such as a conductive component thereof. Theinterconnect extends around or surrounds the electronics module. Forinstance, the interconnect is disposed along a perimeter of the chassisto surround the electronics module. In some cases and/or along one ormore portions, the interconnect is discontinuous to allow air flow forcooling of the electronics module.

The interconnect may include a number of contacts. In some cases, thecontacts are spaced apart from one another to allow the air flow.Alternatively or additionally, apertures in the contacts allow the airflow. The apertures may also reduce mass and part costs. The spacing, orthe size of the apertures, may vary. For instance, the spacing oraperture size may vary based on a number of facts, including, forinstance, the frequencies of the electromagnetic noise, the proximity toan antenna, and/or the proximity to the electronics module. Each contactmay configured as or include a strip. The orientation of the strips mayvary. For instance, the strips (or other contacts) may be orientedwithin a common plane and/or in separate planes as warranted for airflow and/or shielding.

The contacts may be configured and/or positioned to avoid generatingvisual artifacts. Visual artifacts may otherwise be generated by a touchevent on a touch-sensitive display or other vertical force imposed uponthe display module. The perimeter positioning of the interconnect mayavoid the bowing of the interior of the display module. Alternatively oradditionally, the contacts may be configured to convert a vertical forceimposed on the electronic device into a lateral (e.g., outward) force.

The shielding may be useful in connection with a number of differenttypes of antennas. The antenna(s) may be directed to wireless networkconnections (e.g., IEEE 802.11), short-range device connectivity (e.g.,Bluetooth), and/or mobile broadband communications. The discloseddevices are thus not limited to any particular antenna, antenna type,and/or antenna arrangement.

The shielding is well suited for use with a wide variety of differentelectronic devices. For example, the size and form factor of theelectronic device may vary considerably. Devices may range from wearableor handheld devices to televisions or other wall-mounted displays orother large-scale devices. Although some aspects relate to displayshaving a touchscreen or touch sensor unit, the electronic devices maynot include a touch sensor or a touch-sensitive display. The compositionand other characteristics of the display module and other components ofthe electronic device may also vary. For example, various types ofdisplays may be used, including, for instance, organic light emittingdevice (OLED) displays and plasma displays.

FIGS. 1 and 2 show an electronic device 100 with electromagneticshielding in accordance with one example. The electronic device 100includes a case 102 (or shell) and an antenna 104 supported by the case102. The case 102 may be configured as a bucket, tray, or othercontainer in which the internal components of the electronic device 100are disposed. The case 102 may thus act as a housing for the components.In this example, the case 102 defines a tablet-shaped housing.

The case 102 includes a bottom cover or backside 106 (FIG. 2) andsidewalls 108 extending upward or forward from the bottom cover 106(FIG. 2). In this example, the antenna 104 is carried or mounted on afront or end surface 110 (FIG. 2) of one of the sidewalls 108. The widthof the end surface 110 may be exaggerated in FIG. 1 for ease inillustration of the antenna 104. The sidewalls 108 may or may not beorthogonally oriented to the back cover 106. In some cases, thesidewalls 108 and/or the back cover 106 may be curved.

The electronic device 100 may include a transparent cover 112 disposedalong a front side of the electronic device 100 opposite the bottomcover 106 of the case 102. The transparent cover 104 acts as an externaldisplay layer of the electronic device 100. In this example, thetransparent cover 112 extends the entire lateral extent of theelectronic device 100. The transparent cover 112 may thus extend acrossand over the sidewalls 108 of the case 102. The transparent cover 112may thus rest upon, or cover, the end surfaces 110 of the sidewalls 108and/or the antenna 104, as shown in FIG. 2. In other examples, the case102 (or other component of the electronic device 100) has beveled edgesthat define an inner perimeter at which the transparent cover 110terminates.

The transparent cover 112 extends over a display module 114 disposedwithin the case 102. The display module 114 may include, or beconfigured as, a number of units or panels arranged in a stack of filmsor layers. In this example, as shown in FIG. 2, the display module 114include a touch sensor unit 116 to configure the display module 114 as atouch-sensitive display, or touchscreen. In some cases, the touch sensorunit 116 may be applied to an underside of the transparent cover 112. Inthis example, the display module 114 further includes a backlight unit118, and a liquid crystal (LC) unit 120 between the backlight unit 118and the touch sensor unit 116, and a number of light management films122, such as a color filter layer, between the LC unit 120 and thebacklight unit 118. The backlight unit 118 may include a light guideplate and various light management films or layers, such as a reflectorfilm behind the light guide plate. These and other constituentcomponents of the display module 114 are not shown in FIG. 1 in order todepict (in phantom) other internal components of the electronic device100.

The electronic device 100 includes a chassis 124 disposed within thecase 102. The chassis 124 may be adhesively bonded to the transparentcover 112 and/or the case 102. Alternatively or additionally, thechassis 124 may be engage, the case 102 via, e.g., an overhang or lip.The chassis 124 structurally supports the display module 114. Forexample, the constituent units of the display module 114 may be stackedon or otherwise carried by the chassis 124. In some cases, the backlightunit 118 rests upon a base plate 126 (FIG. 2) of the chassis 124. Forexample, the reflector film of the backlight unit 118 may be secured to,or otherwise in contact with, the base plate 126. The backlight unit 118and other units of the display module 114 are laterally contained withina number of sidewalls 128 of the chassis 124 that extend upward, orforward, from the base plate 126. In the example of FIGS. 1 and 2, eachsidewall 128 of the chassis 124 is disposed inward of, and extendingalong, a respective one of the sidewalls 108 of the case 102. Theantenna 104 may then be mounted on, disposed in, or otherwise supportedby the sidewall 108 of the case 102 outward of a respective one of thesidewalls 128 of the chassis 124. The antenna 104 may be supported bythe case 102 in other ways. For instance, the antenna 104 may bedisposed within the case 102, e.g., on a printed circuit board mountedor otherwise supported within the case 102.

Also disposed within the case 102 are an electronics module 130 and abattery 132. The electronics module 130 and the battery 132 may bedisposed within a space, or cavity, defined by the case 102 and thechassis 124. The electronics module 130 may be spaced from one or bothof the case 102 and the chassis 124 to allow air to flow through thecavity for cooling. Additional components of the electronic device 100may also be disposed within the space occupied by the electronics module130 and the battery 132.

The electronics module 130 may include a number of electroniccomponents, including, for instance, a microprocessor, flash memory,transceivers, and power supply circuitry. The electronic components maybe mounted on one or more circuit boards. The components of theelectronics module 130 may vary considerably given the functionality ofthe electronic device 100.

The chassis 124 may have one or more holes to accommodate wiring betweenthe electronics module 130 and the display module 114. The wiring maycarry control signals and/or power for the components of the displaymodule 114.

The components of the electronics module 130 generate electromagneticnoise. The frequency spectrum of the electromagnetic noise may overlapwith the frequency band of the antenna 104. The antenna 104 is shieldedfrom the electromagnetic noise by the chassis 124. As shown in FIGS. 1and 2, the chassis 124 is disposed between the antenna 104 and theelectronics module 130.

The chassis 124 may include one or more conductive components to providethe shielding. In some cases, the chassis 124 is constructed or composedof one or more metals (e.g., aluminum) or other conductive materials.For example, the chassis 124 may be composed of or constructed withsheet metal. In other cases, the chassis 124 may include a conductivefilm or layer in addition to one or more structural layers, which may benon-conductive. For instance, the chassis 124 may include a metal layerelectroplated on a rigid, dielectric substrate. Alternatively, theconductive film may be a buried layer, e.g., an inner layer sandwichedbetween outer dielectric layers. The dielectric layers may be composedof a material that provides a desired amount of structural rigidity. Ineither case, the chassis 124 may be referred to herein as a conductivechassis as a result of the conductive component(s) thereof.

The sidewalls 128 of the chassis 124 may be positioned or configured toprovide shielding. In the example of FIG. 2, the sidewalls 128 extendupward, or forward, to contact the transparent cover 112. The sidewalls128 may thus be disposed alongside the antenna 104. The forward extentof the sidewalls 128 may vary. For instance, the sidewalls 128 may notreach or contact the transparent cover 112. A chassis with shortersidewalls may nonetheless provide suitable shielding if, for instance,the antenna 104 is disposed within, or at an intermediate locationalong, one or more of the sidewalls 108 of the case 102 (rather than onthe end surface 110 of the sidewall 108).

The display module 114 (and/or the electronic device 100) may includeother internal structural support elements in addition to the chassis124. In the example of FIG. 2, a frame 134 of the display module 114provides structural support in addition to the chassis 124. The frame134 may be disposed along, and configured to engage, a periphery of oneor more of the films, layers, or other display components of the displaymodule 114, such as the light management films 122. In some cases, anumber of light sources of the backlight unit 118, such as edge-mountedlight emitting diode (LED) devices, are carried or otherwise supportedby the frame 134. The frame 134 is disposed within, and supported by,the chassis 124. For example, the frame 134 may be disposed in thelateral space between the units of the display module 114 and thesidewalls 128 of the chassis 124. The frame 134 may be a moldedcomponent. The frame 134 may accordingly be configured as a mold frame.The display module 114 may include additional, fewer, or alternativeframes or framing.

Shielding is also provided by an interconnect 136 that electricallyconnects the chassis 124 and a conductive component of the case 102. Asshown in FIG. 1, the interconnect 136 extends around the electronicsmodule 130. Noise generated by the electronics module 130 may thus beblocked by the interconnect 136.

The interconnect 136 may surround the electronics module 130 to providethe shielding. In the example of FIG. 1, the interconnect 136 includesfour walls 138-141 positioned along a perimeter of the chassis 124. Thewalls 138-141 of the interconnect 136 may be positioned in parallel withthe sidewalls 128 of the chassis 124. The walls 138-141 of theinterconnect 136 may surround the electronics module 130 in these andother configurations.

The interconnect 136 may also be positioned along the sidewalls 108 ofthe case 102. In the example of FIG. 1, a respective one of the walls138-141 of the interconnect 136 is positioned in parallel with, orotherwise along, a respective one of the sidewalls 108 of the case 102.The interconnect 136 may thus surround other internal components of theelectronic device 100, such as the battery 132. In other examples, oneor more walls or other portions of the interconnect 136 may not extendalong the sidewalls 108 of the case 102.

The walls 138-141 may or may not be aligned with the sidewalls 108 ofthe chassis 124. As shown in FIG. 1, the positioning of the walls138-141 relative to the sidewalls 108 may vary. In that example, thewalls 138, 140 are offset from the sidewalls 108, while the wall 141laterally overlaps with one of the sidewalls 108. Other positions of thewalls 138-141 may be used.

The interconnect 136 may be discontinuous to remove heat generated bythe electronics module 130. One or more of the walls 138-141 of theinterconnect 136 may be discontinuous. The discontinuous nature of theinterconnect 136 allows air flow passing through the case to reach theelectronics module 130. In the example of FIGS. 1 and 2, all four of thewalls 138-141 of the interconnect 136 are discontinuous. In otherexamples, one or more of the walls 138-141 may be continuous, or solid.

The discontinuities in the interconnect 136 may be provided in variousways. In the example of FIGS. 1 and 2, the discontinuities are providedby using a number of spaced apart contacts 142 that collectively formthe interconnect 136. The contacts 142 extend from the chassis 124and/or the conductive component of the case 108, such as the bottomcover 106. In some cases, a pair of the contacts 142 are used toestablish each electrical connection, one of the contacts 142 extendingrearward (or downward) from the chassis 124 and the other one of thecontacts 142 extends forward (or upward) from the bottom cover 106 ofthe case 102. The contacts 142 then overlap to form the connection.Examples are described in connection with FIGS. 4-8. Alternatively oradditionally, a respective one of the electrical connections isestablished via a single, respective one of the contacts 142 thatextends from both the chassis 124 and the bottom cover 106.

Each contact 142 may be shaped as, or otherwise, include a strip or tab.As shown in FIG. 1, the strip-shaped contacts 142 may be orientedin-plane or out-of-plane. For instance, the strips of the contacts 142along the wall 139 of the interconnect 136 are oriented in parallel withthe plane of the wall 139. Conversely, the strips of the contacts 142along the wall 138 are oriented orthogonally to the plane of the wall138. The difference in the orientation may allow the effective spacingof the interconnect 136 to be modulated without forcing the size and/orshape of the interconnect components to be modified. The orientation ofthe contacts 142 may be selected in accordance with the extent to whichshielding is warranted at particular locations of the electronic device100. For instance, locations near the antenna 104 may warrant anin-plane orientation. Proximity to heat sources and/or air holes in thecase 102 may be alternative or additional considerations for theorientation of the contacts 142.

The density of the contacts 142 may also be selected to achieve adesired level of shielding. A change in the density of the contacts 142may thus lead to a difference in the spacing along respective sectionsof the interconnect 136. In the example of FIG. 1, the spacing betweenadjacent out-of-plane contacts 142 differs between the walls 138 and140. Adjacent contacts 142 along the wall 140 are closer to one another,which may be useful if, for instance, holes in the case 102 are disposedalong the sidewall 108 closest to the wall 140.

The conductive component of the case 102 to which the interconnect 136is connected may be disposed along a rear side of the case 102. In somecases, the conductive component of the case 102 is or includes thebottom cover 106. For example, the bottom cover 106 may be composed of,or include, magnesium and/or another metal or other conductive material.Other sections of the case 102 may then be composed of a different(e.g., non-conductive) material. For example, the sidewalls 108 of thecase 102 may be composed of a dielectric material.

FIG. 2 is a cross-section taken along lines II-II of FIG. 1 to depictthe display module 114, the chassis 124, and the wall 138 of theinterconnect 136 in greater detail. In this example, the spacing betweenthe contacts 142 is constant across the length of the wall 138. In othercases, the spacing may vary within a particular one of the walls. Forinstance, the spacing may be greater near the battery 132 than near theelectronics module 130.

An air gap may be maintained between the chassis 124 and the electronicsmodule 130. The gap may facilitate the removal of heat from theelectronic device 100.

FIG. 3 depicts the contacts 142 along one of the walls of theinterconnect 136 in greater detail. In this example, the wall 141 of theinterconnect 136 includes contact strips 144 that extend downward (orrearward) from the chassis 124, and contact strips 146 that extendupward (or forward) from the bottom cover 106 of the case 102 (FIG. 2).The contract strips 144, 146 overlap to establish the electricalconnection.

In the example of FIG. 3, and as shown in FIG. 1, each contact strip144, 146 is oriented in the plane in which the wall 141 is disposed.Alternatively, the contact strips may be oriented at an angle (e.g.,orthogonally) to the plane of the wall. The orientation may vary betweenwalls (or sections thereof) of a particular device.

The width and spacing of the contact strips 144, 146 may vary to providea desired amount of shielding in one or more frequency bands. The widthcorresponds with the dimension of the plane in which the wall 141 isdisposed. In the example of FIG. 3, the width of each contact strip 144,146 equals the spacing between adjacent contacts strips 144, 146. Thewidth and spacing may be, for instance, approximately 2 mm. Other widthsand spacings may be used. In some cases, the width is not equal to thespacing. For example, in some cases, the width falls in a range fromabout 0.5 mm to about 1 mm, while the spacing falls in a range fromabout 1.5 mm to about 3 mm. Both the width and spacing may varyconsiderably in accordance with one or more factors, including thefrequency band(s) of the antenna 104 (FIG. 1), the characteristics ofthe noise generated by the electronics module 130 (FIG. 1), the relativepositioning of the noise source(s) and the antenna 104, the relativepositioning of the heat sources (e.g., the electronics module 130(FIG. 1) or a component thereof, and different levels of cooling.

The widths and spacing may vary between walls (or sections thereof) of aparticular device. For instance, as shown in the example of FIG. 1, thespacing along the wall 138 is greater than the spacing along the wall140. The wall 138 has larger spacing due to its proximity to theelectronics module 130.

The length of the contacts 142 may vary in accordance with the verticalspacing between the chassis 124 and the bottom cover 106. The verticalspacing may vary considerably given the thickness of the device. In oneexample, the vertical spacing is about 3.5 mm. Each contact 142 may thushave a length that exceeds 1.75 mm (half of 3.5 mm) to establish theoverlap and electrical connection. In other cases, a single contact isused to extend the entire vertical spacing between the chassis 124 andthe bottom cover 106. In these and other cases, the bottom cover 106 mayinclude sockets or other structures engaged by the contacts 142 to formcontact points for the electrical connection.

FIGS. 4-8 are examples of interconnects having contacts configured toavoid imparting force upon the display module. Avoiding such forceswould, in turn, minimize or prevent the generation of optical defects.Avoiding such forces may also minimize or prevent the perceiveddeflection of the transparent cover of the electronic device. In of thedepicted examples, the contacts are shaped to convert a vertical forceto a lateral force. FIG. 4 depicts an example with strip-shapedcontacts. FIGS. 5 and 6 depict an example with wedge-shaped contacts.FIGS. 7 and 8 depict an example in which one contact is strip-shaped andthe other contact is wedge-shaped.

Turning to FIG. 4, an interconnection 400 includes a pair ofstrip-shaped contacts 402. Each contact 402 includes a bracket 404configured and oriented to convert a vertical force imposed upon thedisplay module 114 (FIG. 1) into a lateral force. Each contact 402 maybe configured to act as a spring, such as a cantilever. In this example,the bracket 404 includes a base 406, a resilient arm 406 extendingoutward from the base 406. The resilient arm 406 acts as a spring thatengages the other contact 402 once assembled. One or both of theresilient arms 406 may be pre-loaded. Each arm 406 terminates in acurved end 408. The curved ends 408 may act as clips that interlock thebrackets 404. Friction and the lateral force exerted by the resilientarms 406 also hold the contacts 402 in place. The base 406 is secured toeither the chassis 124 (FIG. 1) or the bottom cover 106 (FIG. 1) via anadhesive or other fastener 410.

In operation, an increase in the force applied to the display module 114(FIG. 1) or the bottom cover 106 (FIG. 1) increases the extent to whichthe brackets 404 overlap with one another. In the example of FIG. 4, theforce is a vertical (or compressive) force that acts to increase theextent to which the pair of contacts 402 are engaged. The arms 406 ofthe brackets 404 may increasingly overlap, e.g., pushing the contact 402secured to the chassis 124 (FIG. 1) laterally outward. The cantileverconfiguration of the interconnection 400 thus converts the verticalforce into a lateral, outward force.

The outward force may cause the display module 114 to be pulled down atits center rather than pushed up by an opposing force from the bottomcover 106 (FIG. 1). Visual artifacts or disturbances in the displayoutput may thus be avoided. Display output problems may also oralternatively be avoided via the peripheral placement of theinterconnect.

The contacts 402 are secured to the chassis 124 (FIG. 1) or the bottomcover 106 (FIG. 1) by adhesive pads 406. The adhesive pads 406 may beconductive to support the electrical connection. Any conductive adhesivematerial may be used. The composition, construction, and othercharacteristics of the adhesive pads 406 may vary. Other fasteners maybe used.

In FIGS. 5 and 6, an interconnection 500 includes an arrangement ofwedge shaped contacts 502-504. In this example, the arrangement includesthree contacts 502-504 that extend the length of the interconnect wall.The contact 502 may be adhesively or otherwise secured to the chassis124 (FIG. 1). The other two contacts 503, 504 may be adhesively orotherwise secured to the bottom cover 106 (FIG. 1). Other arrangementsmay include additional or fewer contacts.

Each contact 502-504 may be constructed as a foam block. The foam of theblock may include, or be composed of, metal and/or another conductivematerial. Alternatively or additionally, the foam of the block may beenclosed in a conductive wrapper. For example, the conductive wrappermay be configured as a conductive fabric. The conductive wrapper mayinclude, or be composed of, metal and/or another conductive material.

Each contact 502-504 includes a resilient wedge configured to slidablyengage one of the other contacts. In the example of FIG. 5, each contact502-504 includes a chamfered edge 506. The chamfered edges 506 ofadjacent blocks 502-504 slidably engage one another such that acompressive or vertical force is converted into a lateral force. As theoverlap of the contacts 502-504 changes with the applied force, one ormore of the resilient wedges may act as a spring. In this example, thewedge 502 may be compressed laterally, and the wedges 503 and 504 aredeflected laterally. In other examples (e.g., a two-wedge arrangement),all (e.g., both) of the wedges are deflected laterally.

The contacts 502-504 are also discontinuous to allow air flow. As shownin FIG. 6 (and in phantom in FIG. 5), each resilient wedge has anaperture 508 oriented to allow the air flow passing through the case toreach the electronics module 130 (FIG. 1). The size, shape, and spacingof the apertures 508 may vary in accordance with the same factorsdescribed above in connection with FIG. 3. For example, the apertures508 may be larger when greater air flow is warranted, and/or smallerwhen more noise suppression is warranted.

FIGS. 7 and 8 depict an interconnection 700 that involves a hybrid ofthe above-described contact arrangements. In this example, theinterconnection 700 includes a strip-shaped contact 702 and awedge-shaped contact 704 that overlaps the strip-shaped contact 702. Oneor both of the contacts 702, 704 may be resilient as described above.The contacts 702, 704 are configured to slidably engage one another toconvert the vertical force into a lateral force. To that end, thewedge-shaped contact 704 has a detent 706 in which a curved end 708 ofthe contact 702 is captured. As the vertical force increases the overlapof the contacts 702, 704, one or both of the contacts 702, 704 aredeflected laterally.

The interconnection 700 is also configured to allow air flow. In thisexample, as shown in FIG. 8, the strip-shaped contact 702 has a numberof apertures 710. The apertures 710 may be distributed along the lengthof the contact 702 as shown. Alternatively or additionally, thestrip-shaped contact 702 may be gapped as described above in connectionwith the example of FIGS. 1-3. In these and other cases, thewedge-shaped contact 704 may include apertures for air flow.

Still other types of interconnections may be used. For example, contactsmay be constructed from conductive elastomers and wire brusharrangements.

The construction and configuration of the device 100 may vary from theexample shown in FIG. 1. The case 102 and the transparent cover 112 maynot the only components relied upon to enclose the internal componentsof the device 100. In other cases, additional structures, such as aside-mounted antenna, may also be used to enclose the internalcomponents. The case 102 and the transparent cover 112 may have avariety of shapes to accommodate various form factors of the device 100.

The transparent cover 112 may be composed of one or more layers of glass(e.g., chemically strengthened or non-strengthened glass) and/orplastic. In other examples, the external display layer of the electronicdevice 100 may be an integral layer or component of the display module114. For example, an external polarizer of the display module 114 mayact as the external display layer.

In the example of FIG. 1, the display module 114 is adjacent to thetransparent cover 112. In some cases, the transparent cover 112 and thedisplay module 114 are contiguous with one another. The transparentcover 112 and the display module 114 may be adhesively bonded orotherwise secured to one another. In other cases, one or moretransparent films, layers, or other structures are disposed between thetransparent cover 112 and the display module 114.

Each unit of the display module 114 may be a composite structure thatincludes multiple constituent layers or films. Each layer or film may beconsidered a component of the display module 114. In some cases, thetouch sensor unit 116 may be formed on the back side of the transparentcover 112 or added thereto as a film, as in an on-cell touch sensorarrangement. The LCD unit 120 may include a liquid crystal layerdisposed between two glass layers, e.g., a color filter layer and anactive matrix layer.

The display module 114 may include additional, fewer, or alternativeunits, panels, or layers. For example, the display module 114 mayinclude an emissive display layer, such as an organic light emittingdiode (OLED) layer, rather than the backlight and LC units 118, 120.Alternatively or additionally, one or more components or layers of theunits of the display module 114 may be integrated with the transparentcover 112. For example, the transparent cover 112 may be replaced by oneor more components or constituent layers of the display module 114. Forexample, the display module 108 may include a touch sensor panelpre-applied to the outer surface of the color filter layer of the LCDunit 120 in an in-cell touch sensing arrangement. In such cases, theexternal display layer of the device 100 may be provided by the externalpolarizer of the LCD unit 120. The relative positions of the units ofthe display module 114 (and/or constituent layers thereof) may thusvary. The extent to which the units are integrated may also vary.

The configuration and construction of the units of the display module114 may vary. In some cases, the touch sensor unit 116 may be or includethe Exclear touch sensor film commercially available from FujifilmCorporation, but other sensors and/or sensor films may be used. The LCDunit 120 may be configured as an in-plane switched (IPS) display or aplane-to-line switched (PLS) display, but other types of displaytechnologies may be used, such as vertical alignment (VA) displays.

The case 102 may have a one-piece construction. For example, thesidewalls 108 and the back cover 106 may be integrally formed. In othercases, the shell 102 may be a composite structure. For example, theshell 102 may include a bezel or other peripheral component extendingfrom the sidewalls 108. A variety of other shell configurations andconstructions may be used for the case 102. For example, in some cases,the case 102 does not include sidewalls. In such cases, the transparentcover 112 may be curved or include sidewalls that meet the back cover106 of the shell 102. In other examples, both the transparent cover 112and the case 102 are curved to meet one another or another component ofthe external surface.

In some cases, the bezel or sidewalls 108 may be configured as, orinclude, one or more antenna strips. Each antenna strip may be composedof a metal or other conductive material,

The electronic device 100 may include any number of antennas 104. Theantenna(s) 104 may be disposed in any location along the exterior of thedevice 100. For example, one or more antennas 104 may be mounted alongan outer surface of the sidewalls 108. The composition, construction,shape, size, and other characteristics of the antenna(s) 104 may vary.

The chassis 124 may have a one-piece or multi-piece construction. In oneexample, the base plate 126 may be composed of, or include, onematerial, while other components, such as the sidewalls 128, arecomposed of another material (or other materials). The base plate 126may extend over an entire lateral extent of the display module 114. Forexample, the base plate 126 may extend across an entire viewable area ofthe display module 114. The base plate 126 may nonetheless include oneor more openings, such as a cable pass-through and/or other openings forflex cables and/or other connectors to communicatively couple thedisplay module 114 and the electronics module 130. Alternative oradditional openings may be provided for mounting purposes. The baseplate 126 may have any number of openings of varying size and stillprovide structural support in the central area for the display module114 and other components of the device 100. The base plate 126 may alsohave any number of indentations to accommodate the shape or size ofother internal components of the device 100. The base plate 126 may thusbe flat or generally flat.

The electronics module 130 and/or the battery 132 may be secured to anunderside of the chassis 124. The chassis 124 may be configured suchthat the electronics module 130 and/or the battery 120 may be mounted tothe base plate 126. For example, the base plate 126 may have a number ofscrew bosses integrally formed thereon or fabricated thereon. Screw orother fasteners (e.g., adhesive materials) may then be used to securethe electronics module 130 and the battery 132 to the rearward facingside of the base plate 126. The assembly of the chassis 124 and theelectronics module 130 and the battery 132 may then be dropped into thebucket formed by the case 102. In other cases, the electronics module130 and the battery 132 may be press-fit or otherwise secured to thechassis 124 and/or the case 102.

FIG. 9 shows an exemplary electronic device 900 with an electronicsmodule 902 that may be shielded as described herein. The electronicdevice 900 further includes a display module 904 and a battery 906, eachof which is coupled to the electronics module 902. The display module904 may be integrated with the electronics module 902 and/or othercomponents of the electronic device 900 to a varying extent. Forinstance, the electronics module 902 and/or the display module 904 mayinclude a graphics subsystem of the electronic device 900. Any number ofdisplay modules or systems may be included. In this example, the device900 includes a processor 908 and one or more memories 910 separate fromthe display module 904. The processor 908 and the memories 910 may bedirected to executing one or more applications implemented by the device900. The display module 904 generates a user interface for an operatingenvironment (e.g., an application environment) supported by theprocessor 908 and the memories 910. The processor 908 may be ageneral-purpose processor, such as a central processing unit (CPU), orany other processor or processing unit. Any number of such processors orprocessing units may be included.

In the example of FIG. 9, the electronics module 902 includes a graphicsprocessing unit (GPU) 912 and firmware and/or drivers 914 for one ormore components of the display module 904. The GPU 912 may be dedicatedto graphics- or display-related functionality and/or provide generalprocessing functionality. Some of the components of the electronicsmodule 902 may be integrated. For example, the processor 908, the one ormore of the memories 910, the GPU 912, and/or the firmware 914 may beintegrated as a system-on-a-chip (SoC) or application-specificintegrated circuit (ASIC).

The electronics module 902 may include additional, fewer, or alternativecomponents. For example, the electronics module 902 may not include adedicated graphics processor, and instead rely on the CPU 908 or othergeneral-purpose processor to support the graphics-related functionalityof the electronic device 900. The electronics module 902 may includeadditional memory (or memories) to support display-related processing.

In the example of FIG. 9, the display module 904 includes a touch sensorunit 916, a backlight unit (BLU) 918, and an LCD panel or unit 920.Additional, fewer, or alternative components may be provided. Forexample, in some cases, the display module 904 does not include thebacklight unit 918 and/or the LCD panel 920. The display module 904 mayinstead include an OLED display unit.

The device 900 includes an antenna 922 shielded from the electromagneticnoise generated by the electronics module 902 as described above. Theantenna 922 may be any type of antenna. The type of communicationconnection may thus vary. The device 900 may include one or moreadditional antennas, any number of which may also be shielded asdescribed above.

The device 900 may be configured as one of a wide variety of computingdevices, including, but not limited to, handheld or wearable computingdevices, such as tablets and watches, communication devices such asphones, laptop or other mobile computers, personal computers (PCs),server computers, set top boxes, programmable consumer electronics,network PCs, minicomputers, mainframe computers, audio or video mediaplayers, and other devices. The device 900 may alternatively beconfigured as one of a wide variety of display devices, such as amonitor or a television.

In one aspect, an electronic device includes a case, an antennasupported by the case, a display module disposed within the case, aconductive chassis disposed within the case, the conductive chassisstructurally supporting the display module, an electronics moduledisposed within the case such that the conductive chassis is positionedbetween the antenna and the electronics module, and an interconnect thatelectrically connects the conductive chassis and the conductivecomponent of the case, the interconnect extending around/surrounding theelectronics module.

In another aspect, an electronic device includes a case including aconductive component, an antenna supported by the case, a display moduledisposed within the case, a conductive chassis disposed within the case,the conductive chassis structurally supporting the display module, anelectronics module disposed within the case such that the conductivechassis is positioned between the antenna and the electronics module,and an interconnect that electrically connects the conductive chassisand the conductive component of the case, the interconnect beingdisposed along a perimeter of the conductive chassis to surround theelectronics module.

In yet another aspect, an electronic device includes a case including aconductive component, an antenna supported by the case, a display moduledisposed within the case, a conductive chassis disposed within the case,the conductive chassis structurally supporting the display module, anelectronics module disposed within the case such that the conductivechassis is positioned between the antenna and the electronics module,and an interconnect that electrically connects the conductive chassisand the conductive component of the case, the interconnect surroundingthe electronics module. The interconnect is discontinuous.

In connection with any one of the aforementioned aspects, the systems,devices, and/or methods described herein may alternatively oradditionally include any combination of one or more of the followingaspects or features. The interconnect is disposed along a perimeter ofthe conductive chassis to surround the electronics module. Theinterconnect is discontinuous to allow air flow passing through the caseto reach the electronics module. The interconnect includes a pluralityof spaced apart contacts that extend from the conductive chassis and/orthe case. Each contact includes a spring oriented to convert a verticalforce imposed upon the display module into a lateral force. Each contactincludes a respective strip. The strips along a first wall of theinterconnect are oriented in parallel with a plane of the first wall.The strips along a second wall of the interconnect are orientedorthogonally to a plane of the second wall. Each contact includes aresilient wedge configured to slidably engage a further contact of theplurality of spaced apart contacts. The resilient wedge has an apertureoriented to allow the air flow passing through the case to reach theelectronics module. The case includes a conductive component disposedalong a rear side of the case. The interconnect electrically connectsthe conductive chassis and the conductive component of the case. Thedisplay module includes a frame and a plurality of display componentssupported by the frame. The frame is disposed within, and supported by,the conductive chassis. The case includes a sidewall. The conductivechassis includes a sidewall disposed inward of, and extending along, thesidewall of the case. The antenna is mounted on the sidewall of the caseoutward of the sidewall of the conductive chassis.

The present disclosure has been described with reference to specificexamples that are intended to be illustrative only and not to belimiting of the disclosure. Changes, additions and/or deletions may bemade to the examples without departing from the spirit and scope of thedisclosure.

The foregoing description is given for clearness of understanding only,and no unnecessary limitations should be understood therefrom.

What is claimed is:
 1. An electronic device comprising: a case; an antenna supported by the case; a display module disposed within the case; a conductive chassis disposed within the case, the conductive chassis structurally supporting the display module; an electronics module disposed within the case such that the conductive chassis is positioned between the antenna and the electronics module; and an interconnect that electrically connects the conductive chassis and the case, the interconnect extending around the electronics module.
 2. The electronic device of claim 1, wherein the interconnect is disposed along a perimeter of the conductive chassis to surround the electronics module.
 3. The electronic device of claim 1, wherein the interconnect is discontinuous to allow air flow passing through the case to reach the electronics module.
 4. The electronic device of claim 3, wherein the interconnect comprises a plurality of spaced apart contacts that extend from the conductive chassis and/or the case.
 5. The electronic device of claim 4, wherein each contact comprises a spring oriented to convert a vertical force imposed upon the display module into a lateral force.
 6. The electronic device of claim 3, wherein each contact comprises a respective strip.
 7. The electronic device of claim 6, wherein the strips along a first wall of the interconnect are oriented in parallel with a plane of the first wall, and wherein the strips along a second wall of the interconnect are oriented orthogonally to a plane of the second wall.
 8. The electronic device of claim 3, wherein each contact comprises a resilient wedge configured to slidably engage a further contact of the plurality of spaced apart contacts.
 9. The electronic device of claim 8, wherein the resilient wedge has an aperture oriented to allow the air flow passing through the case to reach the electronics module.
 10. The electronic device of claim 1, wherein: the case comprises a conductive component disposed along a rear side of the case; and the interconnect electrically connects the conductive chassis and the conductive component of the case.
 11. The electronic device of claim 1, wherein: the display module comprises a frame and a plurality of display components supported by the frame; and the frame is disposed within, and supported by, the conductive chassis.
 12. The electronic device of claim 1, wherein: the case comprises a sidewall; the conductive chassis comprises a sidewall disposed inward of, and extending along, the sidewall of the case; and the antenna is mounted on the sidewall of the case outward of the sidewall of the conductive chassis.
 13. An electronic device comprising: a case comprising a conductive component; an antenna supported by the case; a display module disposed within the case; a conductive chassis disposed within the case, the conductive chassis structurally supporting the display module; an electronics module disposed within the case such that the conductive chassis is positioned between the antenna and the electronics module; and an interconnect that electrically connects the conductive chassis and the conductive component of the case, the interconnect being disposed along a perimeter of the conductive chassis to surround the electronics module.
 14. The electronic device of claim 13, wherein the interconnect is discontinuous to allow air flow passing through the case to reach the electronics module.
 15. The electronic device of claim 13, wherein the interconnect comprises a plurality of spaced apart contacts that extend from the conductive chassis and/or the conductive component of the case.
 16. The electronic device of claim 15, wherein each contact comprises a spring oriented to convert a vertical force imposed upon the display module into a lateral force.
 17. An electronic device comprising: a case comprising a conductive component; an antenna supported by the case; a display module disposed within the case; a conductive chassis disposed within the case, the conductive chassis structurally supporting the display module; an electronics module disposed within the case such that the conductive chassis is positioned between the antenna and the electronics module; and an interconnect that electrically connects the conductive chassis and the conductive component of the case, the interconnect surrounding the electronics module; wherein the interconnect is discontinuous.
 18. The electronic device of claim 17, wherein the conductive component is disposed along a rear side of the case.
 19. The electronic device of claim 17, wherein: the display module comprises a frame and a plurality of display components supported by the frame; and the frame is disposed within, and supported by, the conductive chassis.
 20. The electronic device of claim 17, wherein: the case comprises a sidewall; the conductive chassis comprises a sidewall disposed inward of, and extending along, the sidewall of the case; and the antenna is mounted on the sidewall of the case outward of the sidewall of the conductive chassis. 